Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

The semiconductor equipment industry has witnessed a gradual increase in the proportion of packaging and testing equipment, with the continuous advancement of advanced packaging. Die bonding plays a ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...