Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...